Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM)

Silicon interposer with high bandwidth memory (HBM) has been developed to achieve a terabyte/s bandwidth graphic card module. However, silicon interposer still has critical drawbacks regarding the complexity of fabrication and manufacturing cost. Especially, expensive through-silicon-via (TSV) process has become a serious problem for cost reduction. An innovative package substrate called embedded multi-die interconnect bridge (EMIB) becomes alternative solution for memory industries to reduce manufacturing cost and complexity of fabrication process of silicon interposer. Consequently, signal and power integrity (SI/PI) design and analysis of silicon based EMIB package substrate becomes essential, because it will be dominantly affected to HBM interface. In this paper, superior SI designs of EMIB is proposed and analyzed considering manufacturing cost. In addition, the impact on hierarchical PDN impedance due to EMIB is discussed and we proposed further direction for PI improvement. Proposed designs and analysis of EMIB package substrate are expected to be widely adopted in memory industries for next generation HBM interface.