BIST体系结构，用于在粘接前测试中检测tsvs中的缺陷

2013 18th IEEE European Test Symposium (ETS) Pub Date : 2013-05-27 DOI:10.1109/ETS.2013.6569389

D. Arumí, R. Rodríguez-Montañés, J. Figueras

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引用次数: 5

摘要

硅通孔(tsv)是三维集成电路(3-D ic)中的关键元件。在最早的工艺步骤中检测出有缺陷的tsv是主要关注的问题。因此，测试tsv通常在制造过程的不同阶段进行。在此背景下，本工作提出了一种简单的预粘合GIST结构，以提高对硬缺陷和弱缺陷的检测。

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BIST architecture to detect defects in tsvs during pre-bond testing

Through Silicon Vias (TSVs) are critical elements in three dimensional integrated circuits (3-D ICs). The detection of defective TSVs in the earliest process step is of major concern. Hence, testing TSVs is usually done at different stages of the fabrication process. In this context, this work proposes a simple pre-bond GIST architecture to improve the detection of hard and weak defects.

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2013 18th IEEE European Test Symposium (ETS)

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