结合粘接温度和功率对粘接质量的影响分析

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232597

Yanan Zhang, Lei Han

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引用次数: 0

摘要

通过热超声键合强度试验，研究了键合质量与键合温度和超声功率的关系。结果表明，粘接质量对工艺温度和功率非常敏感。不同超声功率下的最佳键合温度并不相同。同样，在不同的键合温度下，最佳超声功率在0.36 ~ 0.95W之间也不相同。除粘接温度为50℃、超声功率为0.035W外，粘接成功率接近100%。同时，他们的匹配也很重要。通过平均强度插值分析了粘接温度和粘接功率对粘接质量的综合影响。所得数据对进一步的研究有借鉴意义。

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Combining influential analysis of bonding temperature and power on bonding quality

The bonding quality as obtained by strength tests of thermosonic bonding has been investigated as function of bonding temperature and ultrasonic power. The results show that bonding quality is very sensitive to process temperature and power. Optimum bonding temperature is not identical at different ultrasonic power. Analogously, optimum ultrasonic power which appears between 0.36W and 0.95W is not identical at different bonding temperature. The success rate of bonding is nearly 100% except for bonding temperature of 50°C and ultrasonic power of 0.035W. Meanwhile, their match is important. The combining influence of bonding temperature and power on bonding quality is analyzed by the interpolation of mean strength. The obtained data were useful for further researches.

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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