激光微加工微带切比雪夫低通滤波器的研制

H. F. Liew, M. Mazalan, S. Johari, N. Safari, Y. Wahab
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引用次数: 1

摘要

本文介绍了利用先进设计软件(ADS)仿真和激光微加工技术研制五阶切比雪夫微带低通滤波器。本文的意义在于提出了一种利用激光微机械制造低通滤波器的新方法。目前,在MEMS器件的生产中,激光微加工是对传统光刻工艺的补充。使用激光微加工可以导致更精细的完成,提高精度和更少的工艺开销。制造是使用硅衬底实现的,而不是通常使用的FR4衬底。对该微带低通滤波器的仿真与测量结果进行了比较,结果吻合良好。增益约为40dB时,滤波器的抑制性能得到改善。观测到回波损耗匹配响应接近-20dB。制作的电路截止频率更接近于仿真设计频率2.5GHz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of microstrip chebyshev low pass filters using laser micromachining
This paper describes the development of the 5th order Chebyshev microstrip low pass filter using both Advanced Design Software (ADS) simulation and laser micromachining fabrication technique. The significance of this work is the introduction of a new concept used to fabricate low-pass filter which is using laser micromachine. At present, laser micromachine is used to complement conventional photolithography process in the production of MEMS devices. The use of laser micromachining can lead to finer finishes, improved accuracy and less process overhead. The fabrication is implemented using silicon substrate, as opposed to the commonly used FR4 substrate. The simulation and measurement results of microstrip low pass filter fabricated using the micromachine have been compared and excellent agreement is observed. The rejection performance of the filter is improved when the gain is approximately 40dB. The return loss matching response is observed to be near to -20dB. The fabricated circuit cut-off frequency is closer to the simulated design frequency of 2.5GHz.
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