双栅无结晶体管工艺诱导变化的估计

R. K. Baruah, R. Paily
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引用次数: 7

摘要

本文首次报道了工艺诱导变化对无结对称双栅晶体管(DGJLT)电特性的影响。这里考虑的工艺参数是栅极长度(L),硅膜厚度(Tsi)和栅极氧化物厚度(Tox)。通过广泛的器件模拟,系统地研究了这些工艺参数对电学参数(即导通电流、阈值电压(VT)和亚阈值斜率(SS)的影响,并与传统的对称双极晶体管(DGMOS)进行了比较。可以看出,与DGMOS相比,DGJLT的导通电流随硅厚度的变化更高。与DGMOS相比,DGJLT的阈值电压对硅厚度和栅极氧化物厚度更为敏感。与DGMOS相比,DGJLT的总体SS变化可以忽略不计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Estimation of process-induced variations in double-gate junctionless transistor
In this paper, the impact of process induced variations on the electrical characteristics of a junctionless symmetric double-gate transistor (DGJLT) is reported for the first time. The process parameters considered here are gate length (L), thickness of silicon film (Tsi) and gate oxide thickness (Tox). The impact of these process parameters on the electrical parameters viz., ON current, threshold voltage (VT) and subthreshold slope (SS) are systematically investigated with the help of extensive device simulations and compared with conventional symmetric doublegate transistor (DGMOS). It is seen that ON current variation with silicon thickness is higher for DGJLT compared to DGMOS. Threshold voltage of DGJLT is more sensitive to silicon thickness and gate oxide thickness as compared to DGMOS. The overall SS variation is negligible in DGJLT compared to DGMOS.
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