基于j积分的集成电路钝化层裂纹预测

Y.T. He, G.Q. Zhang, W.D. van Drie, X.J. Fan, L. Ernst
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引用次数: 15

摘要

在集成电路中经常观察到钝化层裂纹。复合线或金属线与钝化层之间的界面形成典型的拐角,涉及两种材料。这里将角尖周围的j积分表示为钝化层开裂判据,称为修正j积分判据。利用修正的j积分准则和钝化材料的断裂韧性,可以预测钝化层的开裂情况。本文采用有限元法以能量释放率计算j积分。并对某实例的钝化角j积分值和最可能的开裂方向进行了预测。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cracking prediction of IC's passivation layer using J-integral
Passivation layer cracks in ICs are often observed. The interfaces between compound or metal lines and passivation layers form typical corners, with two materials involved. The J-integral around the corner tip is presented as the passivation layer cracking criterion here, which is called modified J-integral criterion. With this modified J-integral criterion and the fracture toughness of passivation material, the passivation layer cracking can be predicted. Finite Element Method(FEM) is employed in this paper to calculate the J-integral by means of energy release rate. And the passivation corner J-integral value and most possible cracking direction are predicted for a given example.
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