在SOI上使用SiGe hbt以支持高达300°C的新兴应用的潜力

Anup P. Omprakash, P. Chakraborty, Hanbin Ying, A. Cardoso, Adrian Ildefonso, J. Cressler
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引用次数: 7

摘要

首次研究了厚膜SOI上> 100 GHz fT/fmax SiGe hbt的高温(至300°C)直流和交流性能,以研究其在新兴能源领域、汽车和航空航天应用中的潜在应用。从24°C到300°C提取电流增益(βF)、BVCEO、M-1、fT、fmax等指标,并与体SiGe HBT平台进行比较。结果表明,虽然在高温下设备的关键指标会下降,但这些设备在很宽的温度范围内仍然可用。此外,虽然SOI以其高热阻而闻名,但事实证明,该器件在较高温度下受电效应而不是热效应的限制,因此应该产生可接受的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the potential of using SiGe HBTs on SOI to support emerging applications up to 300°C
For the first time, the high temperature (to 300°C) DC and AC performance of a > 100 GHz fT/fmax SiGe HBTs on thick-film SOI are investigated for their potential use in emerging energy sector, automotive, and aerospace applications. Metrics such as current gain (βF), BVCEO, M-1, fT, fmax are extracted from 24°C to 300°C and compared with a bulk SiGe HBT platform. The results demonstrate that while there are degradation to key device metrics at high temperatures, the devices are still usable over a wide temperature range. Additionally, while SOI is known for its high thermal resistance, it is demonstrated that the device is constrained by electrical effects rather than thermal effects at higher temperatures, which should therefore yield acceptable reliability.
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