{"title":"IEC-TR-62380与其他预测标准因封装而导致故障率计算差异的综述","authors":"Dan Butnicu","doi":"10.1109/SIITME53254.2021.9663584","DOIUrl":null,"url":null,"abstract":"One of the major steps in the process of reliability calculation is the failure rate. It is used further for MTBF calculation which is the main reliability metric. In order to estimate failure rate, various techniques such experimental or estimation-based can be used. Over time, reliability industrial guides for the reliability prediction of electronic and electromechanical have had to provide the estimation of the above-mentioned parameter. Thus, well-known is MIL-HDBK-217F, IEC technical report TR- 62380, IEC 61709, FIDES or SN 29500-Siemens AG. Amongst them, only TR-62380 standard seems to taking account of the packaging in the reliability calculation process by mean of the particular mathematical model. In this paper, the detailed mode of calculation and comparison with the others standard methodology are reviewed.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A Review of Failure Rate Calculation’s Differences Due to Package for IEC-TR-62380 vs. other Prediction Standards\",\"authors\":\"Dan Butnicu\",\"doi\":\"10.1109/SIITME53254.2021.9663584\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the major steps in the process of reliability calculation is the failure rate. It is used further for MTBF calculation which is the main reliability metric. In order to estimate failure rate, various techniques such experimental or estimation-based can be used. Over time, reliability industrial guides for the reliability prediction of electronic and electromechanical have had to provide the estimation of the above-mentioned parameter. Thus, well-known is MIL-HDBK-217F, IEC technical report TR- 62380, IEC 61709, FIDES or SN 29500-Siemens AG. Amongst them, only TR-62380 standard seems to taking account of the packaging in the reliability calculation process by mean of the particular mathematical model. In this paper, the detailed mode of calculation and comparison with the others standard methodology are reviewed.\",\"PeriodicalId\":426485,\"journal\":{\"name\":\"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIITME53254.2021.9663584\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME53254.2021.9663584","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Review of Failure Rate Calculation’s Differences Due to Package for IEC-TR-62380 vs. other Prediction Standards
One of the major steps in the process of reliability calculation is the failure rate. It is used further for MTBF calculation which is the main reliability metric. In order to estimate failure rate, various techniques such experimental or estimation-based can be used. Over time, reliability industrial guides for the reliability prediction of electronic and electromechanical have had to provide the estimation of the above-mentioned parameter. Thus, well-known is MIL-HDBK-217F, IEC technical report TR- 62380, IEC 61709, FIDES or SN 29500-Siemens AG. Amongst them, only TR-62380 standard seems to taking account of the packaging in the reliability calculation process by mean of the particular mathematical model. In this paper, the detailed mode of calculation and comparison with the others standard methodology are reviewed.
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