{"title":"基于R2R的多参数交替方向控制方法","authors":"Huating Huang, Jingwen Ma, Chang Xu","doi":"10.1109/CSTIC52283.2021.9461504","DOIUrl":null,"url":null,"abstract":"In semiconductor industry, run-to-run (R2R) can strongly improve process performance by adjusting process parameters. Based on R2R algorithm, Alternating Direction Method is presented to deal with the multi-parameter control problem, especially problem with interaction terms. This method splits parameters into two parts, and updates each part's parameters by R2R algorithm respectively. Moreover by applying the control strategy for low pressure chemical vapor deposition (LPCVD) furnace process, the uniformity of wafer-to-wafer film thickness has been significantly improved.","PeriodicalId":186529,"journal":{"name":"2021 China Semiconductor Technology International Conference (CSTIC)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"R2R Based Alternating Direction Method of Multi-Parameter Control Strategy\",\"authors\":\"Huating Huang, Jingwen Ma, Chang Xu\",\"doi\":\"10.1109/CSTIC52283.2021.9461504\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In semiconductor industry, run-to-run (R2R) can strongly improve process performance by adjusting process parameters. Based on R2R algorithm, Alternating Direction Method is presented to deal with the multi-parameter control problem, especially problem with interaction terms. This method splits parameters into two parts, and updates each part's parameters by R2R algorithm respectively. Moreover by applying the control strategy for low pressure chemical vapor deposition (LPCVD) furnace process, the uniformity of wafer-to-wafer film thickness has been significantly improved.\",\"PeriodicalId\":186529,\"journal\":{\"name\":\"2021 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"54 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-03-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC52283.2021.9461504\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC52283.2021.9461504","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
R2R Based Alternating Direction Method of Multi-Parameter Control Strategy
In semiconductor industry, run-to-run (R2R) can strongly improve process performance by adjusting process parameters. Based on R2R algorithm, Alternating Direction Method is presented to deal with the multi-parameter control problem, especially problem with interaction terms. This method splits parameters into two parts, and updates each part's parameters by R2R algorithm respectively. Moreover by applying the control strategy for low pressure chemical vapor deposition (LPCVD) furnace process, the uniformity of wafer-to-wafer film thickness has been significantly improved.