背增强(BE) SOI pMOSFET在高温下的行为

L. Yojo, J. A. Padovese, R. Rangel, J. Martino
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引用次数: 7

摘要

本文首次报道了新型BE SOI pMOSFET在高达125℃高温下的性能。尽管该器件的导通机制发生在后界面,但随着温度的升高,阈值电压增加(高达1.5 mV/°C),跨导降低(C因子高达1.3),这比传统FD SOI MOSFET观察到的更强。并对其零温度系数(ZTC)进行了测定。应用简单模型计算了ZTC偏置点,模型与实验数据吻合较好。在此温度范围内,体因子几乎可以忽略不计,阈下斜率在高温下表现出强烈的退化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Back enhanced (BE) SOI pMOSFET behavior at high temperatures
This paper reports for the first time the behavior of the new BE SOI pMOSFET at high temperatures up to 125°C. In spite of the conduction mechanism takes place at the back interface in this device, it was obtained an increase of the threshold voltage (up to 1.5 mV/ °C) and a decrease of the transconductance (c-factor up to 1.3) with the temperature increase, which is stronger than the observed for the conventional FD SOI MOSFET. The zero-temperature coefficient (ZTC) was also observed. Furthermore, a simple model was applied to calculate the ZTC bias point, and the model presents a good agreement with experimental data. The body factor is almost negligible within this temperature and the subthreshold slope presents a strong degradation at high temperature.
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