具有370个I/O引线的陶瓷引脚网格阵列封装

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298704

J. Chunfeng, Fu Hualiang, Zheng Hongyu, Li Qiaoming

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引用次数: 0

摘要

目前，大规模集成电路的规模越来越大，并日趋复杂。这推动了高密度集成电路封装的迅速发展，以最大限度地减少电气设备的尺寸和重量，提高其性能。PGA是一种高密度的集成电路封装。开发了一种具有370个I/O引脚的陶瓷引脚网格阵列封装，命名为PGA370。这个包有一个8平方的腔和三层粘合垫。否则，它的引脚排列在交错阵列。采用专用CAD对PGA布线进行设计。对软件进行了修改，以满足这种结构的要求。封装尺寸大，相邻两引脚之间的绝缘体间距非常近。因此，如何实现陶瓷基板尺寸的精确控制，并在陶瓷基板上实现精确的钎焊成为一个挑战。本课题很好地解决了这些问题。在制造过程中成功地采用了选择性镀金技术。金环是镀镍的，其他部分是镀金的。

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A ceramic pin grid array package with 370 I/O leads

The scale of LSI is growing larger and larger and it's turning into complexity at present. This drive the high density package for IC to develop quickly to minimize the size and weight of electrical apparatus and improve its performance. PGA is a kind of high density packages of LSI. A ceramic pin grid array package with 370 I/O leads is developed, which is named PGA370. This package has a eight-square cavity and three-layer bonding pads. Otherwise, its pinouts are arranged in staggered array. It is designed by special CAD for PGA routing. The software is altered to meet the demand of this structure. The package has a large dimension and the insulator spacing between two neighbor pinouts is very close. Thus, it become a challenge to realize the precision dimension control of the ceramic substrate and to obtain accurate brazing on the ceramic substrate. These problems are well resolved in this research subject. Selected-gold-plating technology is successfully used in the manufacture process. The kowar rings are nickel plated and the other parts are gold plated.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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