多层基板的连接冶金在加工过程中的腐蚀

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122173

A. Kumar

{"title":"多层基板的连接冶金在加工过程中的腐蚀","authors":"A. Kumar","doi":"10.1109/ECTC.1990.122173","DOIUrl":null,"url":null,"abstract":"Difficulties encountered with respect to solder wettability and the ability of gold wire to bond to nickel-and-gold plated, thick-film, molybdenum bonding pads were traced to stains observed on the pads after the plating processes. These strains were, in turn, found to be due to galvanic corrosion occurring during processing. The mechanism of stain formation is explained in terms of the lowered ability of nickel to passivate itself upon alloying with molybdenum during the diffusion step following nickel plating, the pitting nature of the corrosion cell, and the insolubility of the corrosion product.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Corrosion of the joining metallurgy in multilayer substrates during processing\",\"authors\":\"A. Kumar\",\"doi\":\"10.1109/ECTC.1990.122173\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Difficulties encountered with respect to solder wettability and the ability of gold wire to bond to nickel-and-gold plated, thick-film, molybdenum bonding pads were traced to stains observed on the pads after the plating processes. These strains were, in turn, found to be due to galvanic corrosion occurring during processing. The mechanism of stain formation is explained in terms of the lowered ability of nickel to passivate itself upon alloying with molybdenum during the diffusion step following nickel plating, the pitting nature of the corrosion cell, and the insolubility of the corrosion product.<<ETX>>\",\"PeriodicalId\":102875,\"journal\":{\"name\":\"40th Conference Proceedings on Electronic Components and Technology\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"40th Conference Proceedings on Electronic Components and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1990.122173\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122173","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

在焊料润湿性和金丝与镀镍和镀金、厚膜、钼结合焊盘的结合能力方面遇到的困难，可以追溯到电镀过程后焊盘上观察到的污渍。反过来，这些菌株被发现是由于加工过程中发生的电偶腐蚀。在镀镍后的扩散过程中，镍在与钼合金化时钝化能力降低，腐蚀细胞的点蚀性质以及腐蚀产物的不溶性解释了斑点形成的机制。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Corrosion of the joining metallurgy in multilayer substrates during processing

Difficulties encountered with respect to solder wettability and the ability of gold wire to bond to nickel-and-gold plated, thick-film, molybdenum bonding pads were traced to stains observed on the pads after the plating processes. These strains were, in turn, found to be due to galvanic corrosion occurring during processing. The mechanism of stain formation is explained in terms of the lowered ability of nickel to passivate itself upon alloying with molybdenum during the diffusion step following nickel plating, the pitting nature of the corrosion cell, and the insolubility of the corrosion product.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量