{"title":"一种新的模拟方法,用于在0.18 μ m模拟,混合信号高压工艺技术上开发ESD原语","authors":"F. Roger, J. Cambieri, R. Minixhofer","doi":"10.1109/SISPAD.2011.6035080","DOIUrl":null,"url":null,"abstract":"This paper presents a full simulation methodology dedicated to the ESD primitive devices development in High Voltage technology. This workflow based on layout generation, 2D, 3D and mixed-mode TCAD simulations and SPICE simulations provide robust devices sustaining ESD stress tests.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A novel simulation methodology for development of ESD primitives on a 0.18µm analog, mixed-signal high voltage process technology\",\"authors\":\"F. Roger, J. Cambieri, R. Minixhofer\",\"doi\":\"10.1109/SISPAD.2011.6035080\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a full simulation methodology dedicated to the ESD primitive devices development in High Voltage technology. This workflow based on layout generation, 2D, 3D and mixed-mode TCAD simulations and SPICE simulations provide robust devices sustaining ESD stress tests.\",\"PeriodicalId\":264913,\"journal\":{\"name\":\"2011 International Conference on Simulation of Semiconductor Processes and Devices\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-10-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 International Conference on Simulation of Semiconductor Processes and Devices\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SISPAD.2011.6035080\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Conference on Simulation of Semiconductor Processes and Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2011.6035080","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A novel simulation methodology for development of ESD primitives on a 0.18µm analog, mixed-signal high voltage process technology
This paper presents a full simulation methodology dedicated to the ESD primitive devices development in High Voltage technology. This workflow based on layout generation, 2D, 3D and mixed-mode TCAD simulations and SPICE simulations provide robust devices sustaining ESD stress tests.