一个实用的互连驱动ASIC设计程序

Mely Chen Chi, J. Tseng, C.Y. Lee, S. Huang
{"title":"一个实用的互连驱动ASIC设计程序","authors":"Mely Chen Chi, J. Tseng, C.Y. Lee, S. Huang","doi":"10.1109/ASIC.1998.722912","DOIUrl":null,"url":null,"abstract":"To shorten design time, it is very important to correctly supply the wire load of nets to the synthesis tool before layout. In this paper, a procedure to create wire load models for a specific processing technology and design flow is presented. Also a physical to logical hierarchy mapping procedure is proposed such that the correct wire load model may be applied to drive synthesis before layout. We apply these methodologies to our company's products of 0.6 /spl mu/m technology as illustrations.","PeriodicalId":104431,"journal":{"name":"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A practical interconnect driven ASIC design procedure\",\"authors\":\"Mely Chen Chi, J. Tseng, C.Y. Lee, S. Huang\",\"doi\":\"10.1109/ASIC.1998.722912\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To shorten design time, it is very important to correctly supply the wire load of nets to the synthesis tool before layout. In this paper, a procedure to create wire load models for a specific processing technology and design flow is presented. Also a physical to logical hierarchy mapping procedure is proposed such that the correct wire load model may be applied to drive synthesis before layout. We apply these methodologies to our company's products of 0.6 /spl mu/m technology as illustrations.\",\"PeriodicalId\":104431,\"journal\":{\"name\":\"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)\",\"volume\":\"50 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASIC.1998.722912\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1998.722912","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

为了缩短设计时间,在布放前正确地向综合工具提供网缆载荷是非常重要的。本文介绍了一种针对特定加工工艺和设计流程的线材载荷模型的创建过程。同时提出了一种物理到逻辑的层次映射程序,以便在布局前应用正确的线负载模型进行驱动综合。我们将这些方法应用到我公司0.6 /spl mu/m技术产品中作为例证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A practical interconnect driven ASIC design procedure
To shorten design time, it is very important to correctly supply the wire load of nets to the synthesis tool before layout. In this paper, a procedure to create wire load models for a specific processing technology and design flow is presented. Also a physical to logical hierarchy mapping procedure is proposed such that the correct wire load model may be applied to drive synthesis before layout. We apply these methodologies to our company's products of 0.6 /spl mu/m technology as illustrations.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信