基于谐振硅光子器件的低功耗光互连:最新进展与挑战

M. Bahadori, K. Bergman
{"title":"基于谐振硅光子器件的低功耗光互连:最新进展与挑战","authors":"M. Bahadori, K. Bergman","doi":"10.1145/3194554.3194606","DOIUrl":null,"url":null,"abstract":"The progressive blooming of silicon photonics technology (SiP) over the last decade has indicated that optical interconnects may substitute the electrical wires for data movement over short distances in the future. A key enabler is the resonant structures that can participate in both modulation and demultiplexing of a high throughput wavelength division multiplexed (WDM) photonic link. The optical and electro-optical properties of such devices are subject to various design considerations, operation conditions, and optimization procedures. We present recent technological advances in photonic links based on resonant structures and highlight the key challenges that must be overcome at a large scale. Furthermore, we discuss how the design space of these resonant devices, down to the geometrical parameters and fabrication errors, can affect the performance and reliability of a photonic link.","PeriodicalId":215940,"journal":{"name":"Proceedings of the 2018 on Great Lakes Symposium on VLSI","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Low-Power Optical Interconnects based on Resonant Silicon Photonic Devices: Recent Advances and Challenges\",\"authors\":\"M. Bahadori, K. Bergman\",\"doi\":\"10.1145/3194554.3194606\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The progressive blooming of silicon photonics technology (SiP) over the last decade has indicated that optical interconnects may substitute the electrical wires for data movement over short distances in the future. A key enabler is the resonant structures that can participate in both modulation and demultiplexing of a high throughput wavelength division multiplexed (WDM) photonic link. The optical and electro-optical properties of such devices are subject to various design considerations, operation conditions, and optimization procedures. We present recent technological advances in photonic links based on resonant structures and highlight the key challenges that must be overcome at a large scale. Furthermore, we discuss how the design space of these resonant devices, down to the geometrical parameters and fabrication errors, can affect the performance and reliability of a photonic link.\",\"PeriodicalId\":215940,\"journal\":{\"name\":\"Proceedings of the 2018 on Great Lakes Symposium on VLSI\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-05-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2018 on Great Lakes Symposium on VLSI\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/3194554.3194606\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2018 on Great Lakes Symposium on VLSI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3194554.3194606","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

近十年来,硅光子学技术(SiP)的不断发展表明,在未来,光互连可能取代电线进行短距离的数据传输。一个关键的使能器是共振结构,它可以参与高吞吐量波分复用(WDM)光子链路的调制和解复用。这些器件的光学和电光特性受制于各种设计考虑、操作条件和优化程序。我们介绍了基于共振结构的光子链路的最新技术进展,并强调了必须大规模克服的关键挑战。此外,我们还讨论了这些谐振器件的设计空间,小到几何参数和制造误差,如何影响光子链路的性能和可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low-Power Optical Interconnects based on Resonant Silicon Photonic Devices: Recent Advances and Challenges
The progressive blooming of silicon photonics technology (SiP) over the last decade has indicated that optical interconnects may substitute the electrical wires for data movement over short distances in the future. A key enabler is the resonant structures that can participate in both modulation and demultiplexing of a high throughput wavelength division multiplexed (WDM) photonic link. The optical and electro-optical properties of such devices are subject to various design considerations, operation conditions, and optimization procedures. We present recent technological advances in photonic links based on resonant structures and highlight the key challenges that must be overcome at a large scale. Furthermore, we discuss how the design space of these resonant devices, down to the geometrical parameters and fabrication errors, can affect the performance and reliability of a photonic link.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信