金属碳纳米管与铜未来VLSI纳米互连的比较

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI:10.1109/SPI.2007.4512200

A. Maffucci, G. Miano, F. Villone

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引用次数: 13

摘要

本文讨论了在未来超大规模集成电路应用中将互连扩展到纳米尺寸的问题。传统的铜互连与由金属碳纳米管束制成的创新互连进行了比较。在经典传输线理论的框架下，提出了一个新的碳纳米管束传输模型。分析了一种可能的未来缩放碳纳米管束微带，并与传统微带进行了比较。

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Comparison between metallic carbon nanotube and copper future VLSI nano-interconnects

This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of metallic carbon nanotubes. A new model is presented to describe propagation along CNT bundles, in the framework of the classical transmission line theory. A possible future scaled CNT bundle microstrip is analyzed and compared to a conventional microstrip.

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2007 IEEE Workshop on Signal Propagation on Interconnects

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