通过片对片电容耦合通信增强片外互连

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI:10.1109/EPEPS.2017.8329736

Xiang Zhang, Dongwon Park, Chung-Kuan Cheng

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引用次数: 0

摘要

我们提出芯片对芯片电容耦合通信(5C)，通过芯片封装侧壁上的金属板增加片外通信，因为由于制造设计(DFM)技术的进步，最先进的电子设计的芯片到芯片间距已经减少。我们证明了5C可以在每个信道上传输20Gbps的数据，并对相邻信道的耦合噪声提供抗扰性。

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Boosting off-chip interconnects through chip-to-chip capacitive coupled communication

We propose Chip-to-Chip Capacitive Coupled Communication (5C) to increase off-chip communication through the metal plate on the side wall of the chip packaging, as the chip to chip spacing for the state of the art electronic designs has been reduced due to the advances of design for manufacturing (DFM) technologies. We demonstrate 5C can transmit 20Gbps data on each channel and provide noise immunity to the coupling noise from adjacent channel.

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来源期刊

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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