作为参数提取工具的mosfet电流对衬底偏置特性

D. Tomaszewski, J. Malesinska, G. Gluszko, K. Kucharski
{"title":"作为参数提取工具的mosfet电流对衬底偏置特性","authors":"D. Tomaszewski, J. Malesinska, G. Gluszko, K. Kucharski","doi":"10.23919/MIXDES.2019.8787068","DOIUrl":null,"url":null,"abstract":"An application of the drain current vs substrate bias characteristics of MOSFETs for the device parameter extraction is presented. Modeling of the substrate bias effect on the MOSFET drain current is briefly discussed. A method of the MOSFET characterization is formulated. It requires a measurement of two I(V) characteristics, including the ID(VBS) smooth curve measured in a \"sweep\" mode. The method allows to extract the threshold voltage parameters and to estimate the in-depth doping profile in the substrate. The proposed approach is demonstrated using I(V) data of the MOSFETs manufactured in ITE in a bulk CMOS process.","PeriodicalId":309822,"journal":{"name":"2019 MIXDES - 26th International Conference \"Mixed Design of Integrated Circuits and Systems\"","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Current vs Substrate Bias Characteristics of MOSFETs as a Tool for Parameter Extraction\",\"authors\":\"D. Tomaszewski, J. Malesinska, G. Gluszko, K. Kucharski\",\"doi\":\"10.23919/MIXDES.2019.8787068\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An application of the drain current vs substrate bias characteristics of MOSFETs for the device parameter extraction is presented. Modeling of the substrate bias effect on the MOSFET drain current is briefly discussed. A method of the MOSFET characterization is formulated. It requires a measurement of two I(V) characteristics, including the ID(VBS) smooth curve measured in a \\\"sweep\\\" mode. The method allows to extract the threshold voltage parameters and to estimate the in-depth doping profile in the substrate. The proposed approach is demonstrated using I(V) data of the MOSFETs manufactured in ITE in a bulk CMOS process.\",\"PeriodicalId\":309822,\"journal\":{\"name\":\"2019 MIXDES - 26th International Conference \\\"Mixed Design of Integrated Circuits and Systems\\\"\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 MIXDES - 26th International Conference \\\"Mixed Design of Integrated Circuits and Systems\\\"\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/MIXDES.2019.8787068\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 MIXDES - 26th International Conference \"Mixed Design of Integrated Circuits and Systems\"","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/MIXDES.2019.8787068","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

介绍了mosfet漏极电流对衬底偏置特性在器件参数提取中的应用。简要讨论了衬底偏置对MOSFET漏极电流影响的建模。提出了一种MOSFET的表征方法。它需要测量两个I(V)特性,包括以“扫描”模式测量的ID(VBS)平滑曲线。该方法可以提取阈值电压参数并估计衬底中的深度掺杂分布。所提出的方法是使用在ITE制造的mosfet在批量CMOS工艺中的I(V)数据来证明的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Current vs Substrate Bias Characteristics of MOSFETs as a Tool for Parameter Extraction
An application of the drain current vs substrate bias characteristics of MOSFETs for the device parameter extraction is presented. Modeling of the substrate bias effect on the MOSFET drain current is briefly discussed. A method of the MOSFET characterization is formulated. It requires a measurement of two I(V) characteristics, including the ID(VBS) smooth curve measured in a "sweep" mode. The method allows to extract the threshold voltage parameters and to estimate the in-depth doping profile in the substrate. The proposed approach is demonstrated using I(V) data of the MOSFETs manufactured in ITE in a bulk CMOS process.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信