{"title":"一种基于表面等效的集成封装耦合电磁元件快速设计和布局迭代方法","authors":"S. Chakraborty, V. Jandhyala","doi":"10.1109/EPEP.2004.1407542","DOIUrl":null,"url":null,"abstract":"A novel methodology is presented that expedites the electromagnetic analysis in the design cycle of individual layout components in close proximity to other radiating and electromagnetic structures. The proposed method retains all the advantages of a surface based moment method technique, but avoids explicit modeling of the interactions between the object under design and the neighboring ones, without compromising on the accuracy of capturing the electromagnetic coupling between them. As a result, the simulation time in an individual design cycle is greatly reduced.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"292 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"A surface equivalence-based method to enable rapid design and layout iterations of coupled electromagnetic components in integrated packages\",\"authors\":\"S. Chakraborty, V. Jandhyala\",\"doi\":\"10.1109/EPEP.2004.1407542\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel methodology is presented that expedites the electromagnetic analysis in the design cycle of individual layout components in close proximity to other radiating and electromagnetic structures. The proposed method retains all the advantages of a surface based moment method technique, but avoids explicit modeling of the interactions between the object under design and the neighboring ones, without compromising on the accuracy of capturing the electromagnetic coupling between them. As a result, the simulation time in an individual design cycle is greatly reduced.\",\"PeriodicalId\":143349,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging - 2004\",\"volume\":\"292 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging - 2004\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2004.1407542\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407542","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A surface equivalence-based method to enable rapid design and layout iterations of coupled electromagnetic components in integrated packages
A novel methodology is presented that expedites the electromagnetic analysis in the design cycle of individual layout components in close proximity to other radiating and electromagnetic structures. The proposed method retains all the advantages of a surface based moment method technique, but avoids explicit modeling of the interactions between the object under design and the neighboring ones, without compromising on the accuracy of capturing the electromagnetic coupling between them. As a result, the simulation time in an individual design cycle is greatly reduced.
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