{"title":"提高DRAM模块可靠性的锡膏中添加Bi和In元素的研究","authors":"Yun-Ting Hsu, Yu Zou, Yi-Yu Chen, Min-Hua Chung, C.L. Gan, Fatima Macalalad, Shriram Harihara Subramanian","doi":"10.23919/ICEP58572.2023.10129742","DOIUrl":null,"url":null,"abstract":"Solder pastes with Bi and In elemental additions were studied by solder joint strength, physical failure analysis, and module reliability tests in this work. Bi-doped solder alloys were found to have stronger solder joints than SAC305 and SnAgCu-In. During the temperature cycling test, SnAgCu-In appeared the best in thermal reliability performance. Samples with Bi and without Bi were observed with different crack modes: trace cracks were found in Bi-doped, and fatigue cracks existed in samples without Bi.","PeriodicalId":377390,"journal":{"name":"2023 International Conference on Electronics Packaging (ICEP)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigation of Bi and In Elemental Addition in Solder Paste for DRAM Module Reliability Enhancement\",\"authors\":\"Yun-Ting Hsu, Yu Zou, Yi-Yu Chen, Min-Hua Chung, C.L. Gan, Fatima Macalalad, Shriram Harihara Subramanian\",\"doi\":\"10.23919/ICEP58572.2023.10129742\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Solder pastes with Bi and In elemental additions were studied by solder joint strength, physical failure analysis, and module reliability tests in this work. Bi-doped solder alloys were found to have stronger solder joints than SAC305 and SnAgCu-In. During the temperature cycling test, SnAgCu-In appeared the best in thermal reliability performance. Samples with Bi and without Bi were observed with different crack modes: trace cracks were found in Bi-doped, and fatigue cracks existed in samples without Bi.\",\"PeriodicalId\":377390,\"journal\":{\"name\":\"2023 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-04-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP58572.2023.10129742\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP58572.2023.10129742","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigation of Bi and In Elemental Addition in Solder Paste for DRAM Module Reliability Enhancement
Solder pastes with Bi and In elemental additions were studied by solder joint strength, physical failure analysis, and module reliability tests in this work. Bi-doped solder alloys were found to have stronger solder joints than SAC305 and SnAgCu-In. During the temperature cycling test, SnAgCu-In appeared the best in thermal reliability performance. Samples with Bi and without Bi were observed with different crack modes: trace cracks were found in Bi-doped, and fatigue cracks existed in samples without Bi.
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