32nm标准细胞对BTI降解的评价

Rafael B. Schivittz, C. Meinhardt, P. Butzen
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引用次数: 0

摘要

老化效应已经成为纳米电路可靠性的关键制约因素。老化的主要机制是BTI(偏置温度不稳定性),它增加了晶体管的阈值电压,降低了系统的工作频率,并可能产生电路时序违规。这项工作提出了一个工具,估计延迟退化由于CMOS逻辑门的BTI效应。该工作评估了一组来自32nm标准库的最常用组合门在不同寿命下的延迟退化。这些信息用于定义由于老化效应而更敏感的门,为设计者提供重要的信息。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An evaluation of BTI degradation of 32nm standard cells
Aging effects has become a critical reliability constraints in nanometer circuits. The major aging mechanism is the BTI (Bias Temperature Instability), which increases the transistor threshold voltage, reducing system operation frequency and may generate a circuit timing violation. This work presents a tool that estimates the delay degradation due to BTI effect in CMOS logic gates. The work evaluates the delay degradation of a set of the most frequently used combinational gates from a 32nm standard library for different lifetimes. This information is used to define the more sensible gates due to aging effect, providing important information to designer.
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