实现“骨架晶圆”测试，用于电气故障分析

2018 International Symposium on Semiconductor Manufacturing (ISSM) Pub Date : 2018-12-01 DOI:10.1109/ISSM.2018.8651160

H. Yanagita, Akihito Jingu, S. Okanishi, S. Tanaka, T. Koyama

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引用次数: 1

摘要

本文提出了一种高成本效益的失效分析方法。研制了全自动“骨架晶圆”测试系统。该系统对锯晶片上的每个裸晶片进行了高通量精确探测，其中许多芯片已被取出，并且具有很高的诊断成功率。并演示了高温测量的扩展应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Realization of “skeleton wafer” testing for electrical failure analysis

This paper proposes a highly cost-efficient failure analysis method for yield enhancement. A fully automatic “skeleton wafer” testing system has been developed. This system has performed high-throughput accurate probing on each bare die on a sawn wafer from which many chips have been taken away and has enabled high success rate of diagnosis. Extended application for high-temperature measurement was also demonstrated.

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2018 International Symposium on Semiconductor Manufacturing (ISSM)

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