高密度外延生长及其对FINFET工艺平面化的影响

Pit Fee Jao, C. Tsao, Ludmila Popova, Jagadeesh Yarramsetty, Brad Chen, S. Shintri, M. Hariharaputhiran, V. Kolagunta
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引用次数: 0

摘要

虽然外延生长提高了PMOS器件的载流子迁移率,但它引入了不必要的生长(UG)缺陷,这是硅锗(SiGe)组件的工件,在大批量生产中成为良率的减损因素。本文介绍了高密度UG缺陷对下游CMP工艺的影响,以及缺陷扫描和原位测量的检测方法。使用高分辨率缺陷扫描和高通量在线计量是检测不合格材料的关键。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High density epitaxial unwanted growth and its effect on planarization in FINFET process
While epitaxial growth enhances carrier mobility of PMOS devices, it introduces an unwanted growth (UG) defect which is an artifact of Silicon Germanium (SiGe) component that becomes a yield detractor in high volume manufacturing. This paper describes the effect of high density UG defect on downstream CMP processes, detection methods using both defect scan and in-situ metrology. Use of high resolution defect scans and high throughput inline metrology was the key to detection of non-conforming material.
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