{"title":"半导体晶圆的往复表面磨削:磨削痕迹与图案的运动学模型","authors":"Qi Zhang, Zhichao Li","doi":"10.1109/CSTIC.2015.7153418","DOIUrl":null,"url":null,"abstract":"Reciprocating surface grinding is one of state-of-the-art machining processes to flatten semiconductor wafers to obtain a better surface roughness and grinding marks uniformity. In this paper, a kinematic model is developed to study the grinding marks pattern resulted from the reciprocating surface grinding. The model is then utilized to simulate the grinding marks and compared with rotary surface grinding. Experiments are also conducted to verify the simulation results.","PeriodicalId":130108,"journal":{"name":"2015 China Semiconductor Technology International Conference","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reciprocating surface grinding of semiconductor wafers: A kinematic model for grinding marks & pattern\",\"authors\":\"Qi Zhang, Zhichao Li\",\"doi\":\"10.1109/CSTIC.2015.7153418\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Reciprocating surface grinding is one of state-of-the-art machining processes to flatten semiconductor wafers to obtain a better surface roughness and grinding marks uniformity. In this paper, a kinematic model is developed to study the grinding marks pattern resulted from the reciprocating surface grinding. The model is then utilized to simulate the grinding marks and compared with rotary surface grinding. Experiments are also conducted to verify the simulation results.\",\"PeriodicalId\":130108,\"journal\":{\"name\":\"2015 China Semiconductor Technology International Conference\",\"volume\":\"102 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 China Semiconductor Technology International Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC.2015.7153418\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 China Semiconductor Technology International Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2015.7153418","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reciprocating surface grinding of semiconductor wafers: A kinematic model for grinding marks & pattern
Reciprocating surface grinding is one of state-of-the-art machining processes to flatten semiconductor wafers to obtain a better surface roughness and grinding marks uniformity. In this paper, a kinematic model is developed to study the grinding marks pattern resulted from the reciprocating surface grinding. The model is then utilized to simulate the grinding marks and compared with rotary surface grinding. Experiments are also conducted to verify the simulation results.