半导体晶圆的往复表面磨削:磨削痕迹与图案的运动学模型

Qi Zhang, Zhichao Li
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摘要

往复表面磨削是目前最先进的平面加工工艺之一,以获得较好的表面粗糙度和磨削痕迹均匀性。本文建立了一种运动学模型来研究往复表面磨削所产生的磨削痕迹。利用该模型对磨削痕迹进行仿真,并与旋转表面磨削进行比较。通过实验验证了仿真结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reciprocating surface grinding of semiconductor wafers: A kinematic model for grinding marks & pattern
Reciprocating surface grinding is one of state-of-the-art machining processes to flatten semiconductor wafers to obtain a better surface roughness and grinding marks uniformity. In this paper, a kinematic model is developed to study the grinding marks pattern resulted from the reciprocating surface grinding. The model is then utilized to simulate the grinding marks and compared with rotary surface grinding. Experiments are also conducted to verify the simulation results.
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