弹性模量对低介电常数薄膜断裂行为的影响

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. Pub Date : 2005-06-06 DOI:10.1109/IITC.2005.1499924

T. Tsui, A. J. Griffin, J. Jacques, R. Fields, A. Mckerrow, R. Kraft

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引用次数: 4

摘要

建立了硅基低/spl kappa/介质(low-/spl kappa/)中通道裂纹扩展行为的预测模型。控制断裂行为的固体力学理论用于获得低/spl kappa/材料常数。这些断裂参数用于预测具有不同弹性模量的5种低/spl kappa/薄膜的断裂行为。所建立的模型表明，裂纹扩展速率对模量非常敏感，特别是当材料是柔顺的时候。

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Effects of elastic modulus on the fracture behavior of low-dielectric constant films

A model that predicts channel-crack propagation behavior in silica-based low-/spl kappa/ dielectrics (low-/spl kappa/) was developed. A solid-mechanics theory that governs fracture behavior was used to obtain low-/spl kappa/ material constants. These fracture parameters were used to predict crack behaviors in five low-/spl kappa/ films with distinct elastic moduli. The model developed demonstrates that crack propagation rate is extremely sensitive to modulus, especially when the material is compliant.

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Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.

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