Study of growth kinetics of intermetallic phases in Cu-Sn solder joints under the conditions of reactive diffusion

The content of the paper is a brief description of the basic characteristics of the reactive diffusion in the dissolution of solid copper in the melt of tin solder. Furthermore, it deals with the theory of growth kinetics of intermetallic phases during heat treatment, and a description of lead-free solders and related problems during soldering. Experimental part contains layout and design of experiments suitable for the study of reactive diffusion, metallographic study and x-ray EDX microanalysis of samples, the calculations of diffusion flows and determination of the rate constants of dissolution.