{"title":"基于宏建模技术的薄膜封装同步开关噪声仿真","authors":"C. Huang, M. Çelik, J. Prince","doi":"10.1109/ECTC.1996.550490","DOIUrl":null,"url":null,"abstract":"This paper presents a fast and accurate methodology for Simultaneous Switching Noise (SSN) simulation for thin film packaging structures using a macro-modeling technique. The combination of interconnect macromodels and SPICE simulation for nonlinear drivers make this technique attractive for large SSN simulation. This technique results in one order of magnitude improvement in the simulation speed for SSN when compared with conventional SPICE run time.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Simultaneous switching noise simulation for thin film packages using macromodeling technique\",\"authors\":\"C. Huang, M. Çelik, J. Prince\",\"doi\":\"10.1109/ECTC.1996.550490\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a fast and accurate methodology for Simultaneous Switching Noise (SSN) simulation for thin film packaging structures using a macro-modeling technique. The combination of interconnect macromodels and SPICE simulation for nonlinear drivers make this technique attractive for large SSN simulation. This technique results in one order of magnitude improvement in the simulation speed for SSN when compared with conventional SPICE run time.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.550490\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.550490","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Simultaneous switching noise simulation for thin film packages using macromodeling technique
This paper presents a fast and accurate methodology for Simultaneous Switching Noise (SSN) simulation for thin film packaging structures using a macro-modeling technique. The combination of interconnect macromodels and SPICE simulation for nonlinear drivers make this technique attractive for large SSN simulation. This technique results in one order of magnitude improvement in the simulation speed for SSN when compared with conventional SPICE run time.
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