现场可编程多芯片模块(FPMCM)-集成了FPGA和MCM技术

J. Darnauer, T. Isshiki, P. Garay, J. Ramirez, V. Maheshwari, W.W. Tai
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引用次数: 10

摘要

多芯片模块技术可用于大幅提高现场可编程门阵列(fpga)及其组成部分的现场可编程系统(FPS)的能力和性能。在分析了MCM技术对fpga的主要优势之后,我们介绍了我们的第一代硅对硅现场可编程多芯片模块(FPMCM)的设计,分析了其局限性,并介绍了在开发过程中的一些经验教训。最后,我们对该应用的MCM-C和MCM-D技术进行了比较,并建议当MCM-D被视为有源基板和片上技术的门户时,用于fpmcm的MCM-D的案例最引人注目。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Field programmable multi-chip module (FPMCM)-an integration of FPGA and MCM technology
Multichip module technology can be used to dramatically increase the capability and performance of field programmable gate arrays (FPGAs) and the field programmable systems (FPS) that they are a part of. After an analysis of the key advantages that MCM technology has for FPGAs, we present the design of our first-generation silicon-on-silicon field programmable multi-chip module (FPMCM), analyze its limitations, and present some lessons learned in the development process. We conclude with a comparison of MCM-C and MCM-D technology for this application and suggest that the case for MCM-D for FPMCMs is most compelling when MCM-D is considered as a doorway to active substrate and chip-on-chip technologies.
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