{"title":"基于精确在线缺陷分类的短周期杀伤颗粒控制","authors":"A. Shimoda, K. Watanabe, Y. Takagi, S. Maeda","doi":"10.1109/ISSM.2000.993648","DOIUrl":null,"url":null,"abstract":"We present a systematic yield ramp-up method that can quickly screen \"killer\" particles associated with yield loss and pinpoint their entry point to the process. The proposed method uses automatic defect classification (ADC) to segregate killer particles. The practicality of this method is demonstrated by the results of experiments using actual production wafers. This method will make killer particle control more timely.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"233 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Short cycle killer-particle control based on accurate in-line defect classification\",\"authors\":\"A. Shimoda, K. Watanabe, Y. Takagi, S. Maeda\",\"doi\":\"10.1109/ISSM.2000.993648\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a systematic yield ramp-up method that can quickly screen \\\"killer\\\" particles associated with yield loss and pinpoint their entry point to the process. The proposed method uses automatic defect classification (ADC) to segregate killer particles. The practicality of this method is demonstrated by the results of experiments using actual production wafers. This method will make killer particle control more timely.\",\"PeriodicalId\":104122,\"journal\":{\"name\":\"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)\",\"volume\":\"233 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2000.993648\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2000.993648","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Short cycle killer-particle control based on accurate in-line defect classification
We present a systematic yield ramp-up method that can quickly screen "killer" particles associated with yield loss and pinpoint their entry point to the process. The proposed method uses automatic defect classification (ADC) to segregate killer particles. The practicality of this method is demonstrated by the results of experiments using actual production wafers. This method will make killer particle control more timely.