提高PCB导线载流能力的技术研究

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI:10.1109/SIITME53254.2021.9663645

A. Drumea, C. Marghescu

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引用次数: 0

摘要

本文研究了提高PCB线路载流能力的几种技术——在线路上镀锡和焊接铜线。这些具有不同宽度和增强轨道的样品板在不同的电流下进行了测试，并进行了电学和热测量。分析了PCB线的载流能力和热性能的提高，并得出了一些结论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Study on Techniques for the Increase of the Current Carrying Capability of the PCB Tracks

The paper investigates some techniques for the increase of the current carrying capabilities of PCB tracks – tinning and soldering of copper wires onto tracks. Such sample boards with tracks of different widths and enhancements were tested at different currents and electrical and thermal measurements were performed. The increase of the current carrying capability and thermal behavior of the PCB tracks are analyzed and some conclusions are presented.

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来源期刊

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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