用田口法研究工艺参数变化对降阶22nm PMOS阈值电压的影响

A. Maheran, P. Menon, S. Shaari, T. Kalaivani, Ibrahim Ahmad, Z. A. N. Faizah, P. R. Apte
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引用次数: 2

摘要

本文通过对22nm平面PMOS晶体管的降阶、设计参数的仿真和优化过程,对22nm平面PMOS晶体管技术进行了改进。采用田口法对缩小装置的工艺参数可变性进行了优化。目的是找到最佳的制造参数组合,以达到阈值电压(Vth)的目标值。高介电常数材料(高k)和金属栅极的组合同时用于取代传统的SiO2/Poly-Si技术。为此,采用二氧化钛(TiO2)作为高k材料,采用硅化钨(WSix)作为金属栅。仿真结果表明,符合ITRS 2012规范的最佳阈值电压(Vth)为-0.289 V±12.7%。这为今后22nm平面PMOS的制备提供了一个基准。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of process parameter variability on the threshold voltage of downscaled 22nm PMOS using taguchi method
This paper provides the enhancement of 22nm planar PMOS transistor technology through downscaling, design parameter simulation and optimization process. The scaled down device is optimized for its process parameter variability using Taguchi method. The aim is to find the best combination of fabrication parameters in order to achieve the target value of the threshold voltage (Vth). A combination of high permittivity material (high-k) and metal gate is utilized simultaneously in replacing the conventional SiO2/Poly-Si technology. For this, Titanium dioxide (TiO2) was used as the high-k material and tungsten silicide (WSix) was used as the metal gate. The simulation results show that the optimal threshold voltage (Vth) of -0.289 V ± 12.7% is achieved in accordance to the ITRS 2012 specifications. This provides a benchmark towards the fabrication of 22 nm planar PMOS in future work.
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