{"title":"印刷电路板被动冷却过程中几何参数和热参数对热应力的影响","authors":"M. Boraey","doi":"10.1109/NILES.2019.8909288","DOIUrl":null,"url":null,"abstract":"The effect of components’ thermal properties in addition to their geometric configuration on the developed thermal stress in a model printed circuit board (PCB) is investigated. This effect is quantified through three parameters, the average normalized temperature gradient, maximum normalized temperature gradient and the uniformity factor. It is found that the effect of the geometric configuration, especially that of the heat-generating component, is more significant than the thermal properties of the components.","PeriodicalId":330822,"journal":{"name":"2019 Novel Intelligent and Leading Emerging Sciences Conference (NILES)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The effect of the geometric and thermal parameters on the thermal stresses during the passive cooling of printed circuit boards\",\"authors\":\"M. Boraey\",\"doi\":\"10.1109/NILES.2019.8909288\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The effect of components’ thermal properties in addition to their geometric configuration on the developed thermal stress in a model printed circuit board (PCB) is investigated. This effect is quantified through three parameters, the average normalized temperature gradient, maximum normalized temperature gradient and the uniformity factor. It is found that the effect of the geometric configuration, especially that of the heat-generating component, is more significant than the thermal properties of the components.\",\"PeriodicalId\":330822,\"journal\":{\"name\":\"2019 Novel Intelligent and Leading Emerging Sciences Conference (NILES)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 Novel Intelligent and Leading Emerging Sciences Conference (NILES)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NILES.2019.8909288\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Novel Intelligent and Leading Emerging Sciences Conference (NILES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NILES.2019.8909288","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The effect of the geometric and thermal parameters on the thermal stresses during the passive cooling of printed circuit boards
The effect of components’ thermal properties in addition to their geometric configuration on the developed thermal stress in a model printed circuit board (PCB) is investigated. This effect is quantified through three parameters, the average normalized temperature gradient, maximum normalized temperature gradient and the uniformity factor. It is found that the effect of the geometric configuration, especially that of the heat-generating component, is more significant than the thermal properties of the components.
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