{"title":"用于掺铒光纤放大器的高性能泵浦激光器模块","authors":"S. Huang, L. A. Greenberg, T.A. Corser","doi":"10.1109/ECTC.1993.346736","DOIUrl":null,"url":null,"abstract":"A 14-pin butterfly pump laser module for erbium-doped fiber amplifiers is described. A high coupling microlens has been realized by etching. A coupling efficiency of 74% has been measured for 1.48-/spl mu/m pump lasers with a variety of far-field angles. The etched microlens is fabricated by batch process and is highly manufacturable. This microlens also provides less reflection and thus interferes less with the operation of lasers. A /spl Delta/T of 60/spl deg/C was measured for an anticipated end-of-life laser chip power dissipation of 1.2 W. The observed performance degradation after a variety of thermal and mechanical shocks is found to be negligible. A maximum change of 5% in coupling efficiency was measured after 2000 hr of 85/spl deg/C bake. The TEC (thermoelectric cooler) resistance measurement showed negligible change, Less than 0.2 dB of temperature tracking error was observed from the routine fabrication data.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"High performance pump laser modules for erbium-doped fiber amplifiers\",\"authors\":\"S. Huang, L. A. Greenberg, T.A. Corser\",\"doi\":\"10.1109/ECTC.1993.346736\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 14-pin butterfly pump laser module for erbium-doped fiber amplifiers is described. A high coupling microlens has been realized by etching. A coupling efficiency of 74% has been measured for 1.48-/spl mu/m pump lasers with a variety of far-field angles. The etched microlens is fabricated by batch process and is highly manufacturable. This microlens also provides less reflection and thus interferes less with the operation of lasers. A /spl Delta/T of 60/spl deg/C was measured for an anticipated end-of-life laser chip power dissipation of 1.2 W. The observed performance degradation after a variety of thermal and mechanical shocks is found to be negligible. A maximum change of 5% in coupling efficiency was measured after 2000 hr of 85/spl deg/C bake. The TEC (thermoelectric cooler) resistance measurement showed negligible change, Less than 0.2 dB of temperature tracking error was observed from the routine fabrication data.<<ETX>>\",\"PeriodicalId\":281423,\"journal\":{\"name\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"volume\":\"87 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1993.346736\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346736","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High performance pump laser modules for erbium-doped fiber amplifiers
A 14-pin butterfly pump laser module for erbium-doped fiber amplifiers is described. A high coupling microlens has been realized by etching. A coupling efficiency of 74% has been measured for 1.48-/spl mu/m pump lasers with a variety of far-field angles. The etched microlens is fabricated by batch process and is highly manufacturable. This microlens also provides less reflection and thus interferes less with the operation of lasers. A /spl Delta/T of 60/spl deg/C was measured for an anticipated end-of-life laser chip power dissipation of 1.2 W. The observed performance degradation after a variety of thermal and mechanical shocks is found to be negligible. A maximum change of 5% in coupling efficiency was measured after 2000 hr of 85/spl deg/C bake. The TEC (thermoelectric cooler) resistance measurement showed negligible change, Less than 0.2 dB of temperature tracking error was observed from the routine fabrication data.<>