焊料凸点的电迁移可靠性

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2014-09-18 DOI:10.1109/IPFA.2014.6898145

H. Ceric, S. Selberherr

{"title":"焊料凸点的电迁移可靠性","authors":"H. Ceric, S. Selberherr","doi":"10.1109/IPFA.2014.6898145","DOIUrl":null,"url":null,"abstract":"Characteristic of solder bumps is that during technology processing and usage their material composition changes. We present a model for describing a growth of intermetallic compound inside a solder bump under the influence of electro-migration. Simulation results based on our model are discussed in conjunction with corresponding experimental findings.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electromigration reliability of solder bumps\",\"authors\":\"H. Ceric, S. Selberherr\",\"doi\":\"10.1109/IPFA.2014.6898145\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Characteristic of solder bumps is that during technology processing and usage their material composition changes. We present a model for describing a growth of intermetallic compound inside a solder bump under the influence of electro-migration. Simulation results based on our model are discussed in conjunction with corresponding experimental findings.\",\"PeriodicalId\":409316,\"journal\":{\"name\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2014.6898145\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898145","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

焊料凸起的特点是在工艺加工和使用过程中，其材料成分发生了变化。我们提出了一个模型来描述在电迁移的影响下，金属间化合物在焊点内的生长。并结合实验结果讨论了基于该模型的仿真结果。

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Electromigration reliability of solder bumps

Characteristic of solder bumps is that during technology processing and usage their material composition changes. We present a model for describing a growth of intermetallic compound inside a solder bump under the influence of electro-migration. Simulation results based on our model are discussed in conjunction with corresponding experimental findings.

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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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