一种无快门微辐射热计热成像系统,使用多个数字相关双采样用于移动应用

Seunghyun Park, Tei Cho, Minsik Kim, Hyungchul Park, Kwyro Lee
{"title":"一种无快门微辐射热计热成像系统,使用多个数字相关双采样用于移动应用","authors":"Seunghyun Park, Tei Cho, Minsik Kim, Hyungchul Park, Kwyro Lee","doi":"10.23919/VLSIC.2017.8008577","DOIUrl":null,"url":null,"abstract":"A micro-bolometer focal plane array (MBFPA)-based long wavelength Infra-red thermal imaging sensor is presented. The proposed multiple digital correlated double sampling (MD-CDS) readout method employing newly designed reference-cell greatly reduces PVT variation-induced fixed pattern noise (FPN) and as a result features much relaxed calibration process, easier TEC-less operation and Shutter-less operation. The readout IC and MBFPA was fabricated in 0.35um CMOS and amorphous silicon MEMS process respectively. The fabricated MBFPA thermal imaging sensor has NETD performance of 0.1 kelvin even though the mechanical shutter is not used.","PeriodicalId":176340,"journal":{"name":"2017 Symposium on VLSI Circuits","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"A shutter-less micro-bolometer thermal imaging system using multiple digital correlated double sampling for mobile applications\",\"authors\":\"Seunghyun Park, Tei Cho, Minsik Kim, Hyungchul Park, Kwyro Lee\",\"doi\":\"10.23919/VLSIC.2017.8008577\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A micro-bolometer focal plane array (MBFPA)-based long wavelength Infra-red thermal imaging sensor is presented. The proposed multiple digital correlated double sampling (MD-CDS) readout method employing newly designed reference-cell greatly reduces PVT variation-induced fixed pattern noise (FPN) and as a result features much relaxed calibration process, easier TEC-less operation and Shutter-less operation. The readout IC and MBFPA was fabricated in 0.35um CMOS and amorphous silicon MEMS process respectively. The fabricated MBFPA thermal imaging sensor has NETD performance of 0.1 kelvin even though the mechanical shutter is not used.\",\"PeriodicalId\":176340,\"journal\":{\"name\":\"2017 Symposium on VLSI Circuits\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 Symposium on VLSI Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/VLSIC.2017.8008577\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 Symposium on VLSI Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSIC.2017.8008577","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

摘要

提出了一种基于微热计焦平面阵列(MBFPA)的长波红外热成像传感器。本文提出的多重数字相关双采样(MD-CDS)读出方法采用了新设计的参考单元,大大降低了PVT变化引起的固定模式噪声(FPN),从而使校准过程更加轻松,更容易进行无tec操作和无shutter操作。读出IC和MBFPA分别采用0.35um CMOS和非晶硅MEMS工艺制作。制备的MBFPA热成像传感器在不使用机械快门的情况下,仍具有0.1开尔文的NETD性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A shutter-less micro-bolometer thermal imaging system using multiple digital correlated double sampling for mobile applications
A micro-bolometer focal plane array (MBFPA)-based long wavelength Infra-red thermal imaging sensor is presented. The proposed multiple digital correlated double sampling (MD-CDS) readout method employing newly designed reference-cell greatly reduces PVT variation-induced fixed pattern noise (FPN) and as a result features much relaxed calibration process, easier TEC-less operation and Shutter-less operation. The readout IC and MBFPA was fabricated in 0.35um CMOS and amorphous silicon MEMS process respectively. The fabricated MBFPA thermal imaging sensor has NETD performance of 0.1 kelvin even though the mechanical shutter is not used.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信