热容式PCB

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI:10.1109/ESTC.2018.8546379

J. Sousa, Sabine Liebfahrt, B. Reitmaier, Maria Prutti, Bernd Schuscha, Q. Tao, J. Nicolics, M. Unger, P. Fulmek

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引用次数: 0

摘要

本文描述了一种热容性PCB概念，其中相变材料(PCMs)嵌入环氧树脂基体中。在含有相变材料填充空腔的PCB表面上安装散热元件。在相变过程中，部分散失的热量被PCB吸收，从而降低了组件的工作温度，并延长了系统达到稳态最高温度的时间。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Heat Capacitive PCB

This paper describes a heat capacitive PCB concept where phase change materials (PCMs) embedded in an epoxy resin matrix is used. A heat dissipating component is installed on the surface of the PCB containing phase change material filled cavities. During phase change, part of the dissipated heat is absorbed by the PCB with the effect of reducing the operational temperature for the component and expanding the time until the system has reached steady state maximum temperature.

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来源期刊

2018 7th Electronic System-Integration Technology Conference (ESTC)

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