三维片上网络的电感耦合链路

2017 International SoC Design Conference (ISOCC) Pub Date : 2017-11-01 DOI:10.1109/ISOCC.2017.8368841

J. Kadomoto, H. Amano, T. Kuroda

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引用次数: 0

摘要

提出了一种三维片上网络(NoC)的电感耦合链路。电感耦合线圈允许堆叠芯片之间的高速无线通信。35位并行输入数据串行化传输。采用65nm SOI CMOS技术的测试芯片实现收发器电路的硅测量显示运行速度为875 Mb/s。

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An inductive-coupling link for 3-D Network-on-Chips

An inductive-coupling link for 3-D network-on-chips (NoC) is presented. Inductively coupled coils allow high-speed wireless communication between stacked chips. 35-bit parallel input data are serialized and transmitted. Silicon measurements from test chips implementing transceiver circuits, in 65 nm SOI CMOS technology demonstrate 875 Mb/s operation.

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2017 International SoC Design Conference (ISOCC)

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