CMOS设计的桥接故障分析和布置图级DFT实验

A. P. Casimiro, M. Simoes, Marcelino B. Santos, I. Teixeira, João Paulo Teixeira
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引用次数: 11

摘要

复杂的数字VLSI电路的高质量测试需要实际的测试准备,即能够推导出测试模式以覆盖由物理缺陷引起的故障。本文讨论了为实际的门级故障模型生成指导测试模式的问题,以及在布局级别引入增强可测试性的新策略。标准单元数字设计实验表明,应将门级、真实桥接故障作为测试准备的目标故障。此外,还证明了涉及扇出节点的桥接故障对可测试性具有主要影响。最后,研究表明,具有可测试性约束的路由是有益的,路由通道应仔细设计以避免硬故障。为了产生这样的结果,开发了一套新的工具,并在这里介绍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experiments on bridging fault analysis and layout-level DFT for CMOS designs
High quality test of complex, digital VLSI circuits require a realistic test preparation, i.e., the ability to derive test patterns to cover faults, originated by physical defects. The issues of guiding test pattern generation for a realistic gate-level fault model, and of introducing new strategies for testability enhancement, at layout level, are addressed. Experiments on standard cell digital designs show the gate-level, realistic bridging faults should be used as target faults for test preparation. Moreover, it is demonstrated that bridging faults involving fanout nodes exhibit a dominant effect on testability. Finally, it is shown that routing with testability constraints is rewarding, and that routing channels should be carefully designed for hard fault avoidance. To produce such results, a new set of tools has been developed, and is presented here.
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