3 GHz以下S参数测量S/390 MCM封装的电气特性

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819197

F. Ktata, U. Arz, H. Grabinski

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引用次数: 3

摘要

在这项工作中，我们研究了IBM S/390 MCM封装中关键信号路径的电气性能。我们提出了集总rlc模型，适用于在时域中工作的标准电路模拟器，例如SPICE。该模型是基于典型信号路径段的有限元仿真而建立的。通过将模型的模拟s参数与双端口网络分析仪的测量结果进行比较，我们在高达3 GHz的频率范围内验证了模型。

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Electrical characterization of S/390 MCM packages from S-parameter measurements below 3 GHz

In this work, we investigate the electrical performance of critical signal paths in IBM S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators operating in the time domain, e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements, we validate the models in a frequency range up to 3 GHz.

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IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

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