{"title":"ASET中异构三维叠加技术的发展","authors":"H. Ikeda","doi":"10.1109/ICSJ.2012.6523453","DOIUrl":null,"url":null,"abstract":"For TSV/3D-Stacking technology developments, Memory Cubes (such as 4-high stack DDR3 SDRAM, Wide-IO DRAM and HMC) have been leading the progress of the technologies [1], [2].","PeriodicalId":174050,"journal":{"name":"2012 2nd IEEE CPMT Symposium Japan","volume":"202 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Heterogeneous 3D Stacking technology developments in ASET\",\"authors\":\"H. Ikeda\",\"doi\":\"10.1109/ICSJ.2012.6523453\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For TSV/3D-Stacking technology developments, Memory Cubes (such as 4-high stack DDR3 SDRAM, Wide-IO DRAM and HMC) have been leading the progress of the technologies [1], [2].\",\"PeriodicalId\":174050,\"journal\":{\"name\":\"2012 2nd IEEE CPMT Symposium Japan\",\"volume\":\"202 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 2nd IEEE CPMT Symposium Japan\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSJ.2012.6523453\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 2nd IEEE CPMT Symposium Japan","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSJ.2012.6523453","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Heterogeneous 3D Stacking technology developments in ASET
For TSV/3D-Stacking technology developments, Memory Cubes (such as 4-high stack DDR3 SDRAM, Wide-IO DRAM and HMC) have been leading the progress of the technologies [1], [2].
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