热超声金球键加速寿命试验

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122226

T. Hund

{"title":"热超声金球键加速寿命试验","authors":"T. Hund","doi":"10.1109/ECTC.1990.122226","DOIUrl":null,"url":null,"abstract":"Accelerated aging tests on gold-ball bonds in hermetic packages have been conducted at 350 degrees C, 300 degrees C, 250 degrees C, and 200 degrees C to determine time to failure, activation energy of failure, and the electrical/mechanical degradation at failure. Four different aluminium/1% silicon metallizations were tested: evaporated metal with P-glass (passivation-glass) contamination, evaporated metal with no P-glass contamination, sputtered metal with P-glass contamination, and sputtered metal with no P-glass contamination. The measured activation energies were from 0.4 to 1.1 eV. Two failure modes were encountered; one was an electrical open with good mechanical strength, and the second was an electrical open that resulted from a premature ball lift caused by voiding under the ball bond. The projected time to failure using an Arrhenius plot indicated that the functional life of gold-ball bonds can exceed 20 yr at ambient temperature if the wire-bonder setup is optimized and the contamination level is low.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Thermosonic gold-ball bond accelerated life test\",\"authors\":\"T. Hund\",\"doi\":\"10.1109/ECTC.1990.122226\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Accelerated aging tests on gold-ball bonds in hermetic packages have been conducted at 350 degrees C, 300 degrees C, 250 degrees C, and 200 degrees C to determine time to failure, activation energy of failure, and the electrical/mechanical degradation at failure. Four different aluminium/1% silicon metallizations were tested: evaporated metal with P-glass (passivation-glass) contamination, evaporated metal with no P-glass contamination, sputtered metal with P-glass contamination, and sputtered metal with no P-glass contamination. The measured activation energies were from 0.4 to 1.1 eV. Two failure modes were encountered; one was an electrical open with good mechanical strength, and the second was an electrical open that resulted from a premature ball lift caused by voiding under the ball bond. The projected time to failure using an Arrhenius plot indicated that the functional life of gold-ball bonds can exceed 20 yr at ambient temperature if the wire-bonder setup is optimized and the contamination level is low.<<ETX>>\",\"PeriodicalId\":102875,\"journal\":{\"name\":\"40th Conference Proceedings on Electronic Components and Technology\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"40th Conference Proceedings on Electronic Components and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1990.122226\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122226","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 8

摘要

在350℃、300℃、250℃和200℃下对密封封装中的金球键进行了加速老化试验，以确定失效时间、失效活化能和失效时的电气/机械退化。测试了四种不同的铝/1%硅金属化:p -玻璃(钝化玻璃)污染的蒸发金属，没有p -玻璃污染的蒸发金属，p -玻璃污染的溅射金属和没有p -玻璃污染的溅射金属。所测活化能在0.4 ~ 1.1 eV之间。遇到两种失效模式;一种是具有良好机械强度的电开口，另一种是由于球粘接下的空隙导致球过早抬升而导致的电开口。使用Arrhenius图预测的失效时间表明，如果优化了线键设置并且污染水平较低，金球键的功能寿命可以在环境温度下超过20年。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermosonic gold-ball bond accelerated life test

Accelerated aging tests on gold-ball bonds in hermetic packages have been conducted at 350 degrees C, 300 degrees C, 250 degrees C, and 200 degrees C to determine time to failure, activation energy of failure, and the electrical/mechanical degradation at failure. Four different aluminium/1% silicon metallizations were tested: evaporated metal with P-glass (passivation-glass) contamination, evaporated metal with no P-glass contamination, sputtered metal with P-glass contamination, and sputtered metal with no P-glass contamination. The measured activation energies were from 0.4 to 1.1 eV. Two failure modes were encountered; one was an electrical open with good mechanical strength, and the second was an electrical open that resulted from a premature ball lift caused by voiding under the ball bond. The projected time to failure using an Arrhenius plot indicated that the functional life of gold-ball bonds can exceed 20 yr at ambient temperature if the wire-bonder setup is optimized and the contamination level is low.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量