{"title":"无机纳米材料在柔性和可生物降解基板上集成的印刷技术","authors":"Abhishek Singh Dahiya, R. Dahiya","doi":"10.1109/ifetc53656.2022.9948444","DOIUrl":null,"url":null,"abstract":"High-quality printed electronic layers are needed for resource efficient fabrication of high-performance electronics on flexible substrates. However, currently there is lack of suitable printing methods for the realisation of high-performance electronic layers. In this work, we present two new approaches to realise high-quality electronic layers by printing inorganic one-dimensional (1D) nanomaterials on diverse flexible and biodegradable substrates, namely: (a) direct transfer printing, and (b) in-tandem contact and transfer printing. The basic printing mechanism, advantages and device applications are presented for both printing methods. Both printing methods hold great potential for the development of next generation high-performance flexible electronics on large areas.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Printing Techniques for Integration of Inorganic Nanomaterials on Flexible and Biodegradable Substrates\",\"authors\":\"Abhishek Singh Dahiya, R. Dahiya\",\"doi\":\"10.1109/ifetc53656.2022.9948444\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High-quality printed electronic layers are needed for resource efficient fabrication of high-performance electronics on flexible substrates. However, currently there is lack of suitable printing methods for the realisation of high-performance electronic layers. In this work, we present two new approaches to realise high-quality electronic layers by printing inorganic one-dimensional (1D) nanomaterials on diverse flexible and biodegradable substrates, namely: (a) direct transfer printing, and (b) in-tandem contact and transfer printing. The basic printing mechanism, advantages and device applications are presented for both printing methods. Both printing methods hold great potential for the development of next generation high-performance flexible electronics on large areas.\",\"PeriodicalId\":289035,\"journal\":{\"name\":\"2022 IEEE International Flexible Electronics Technology Conference (IFETC)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-08-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Flexible Electronics Technology Conference (IFETC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ifetc53656.2022.9948444\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ifetc53656.2022.9948444","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Printing Techniques for Integration of Inorganic Nanomaterials on Flexible and Biodegradable Substrates
High-quality printed electronic layers are needed for resource efficient fabrication of high-performance electronics on flexible substrates. However, currently there is lack of suitable printing methods for the realisation of high-performance electronic layers. In this work, we present two new approaches to realise high-quality electronic layers by printing inorganic one-dimensional (1D) nanomaterials on diverse flexible and biodegradable substrates, namely: (a) direct transfer printing, and (b) in-tandem contact and transfer printing. The basic printing mechanism, advantages and device applications are presented for both printing methods. Both printing methods hold great potential for the development of next generation high-performance flexible electronics on large areas.