脉冲激光沉积铁电弛豫PMN-PT薄膜的结晶特性

S.K. Singh, P. Bhattacharya, P. Thomas, S. Palmer
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引用次数: 0

摘要

研究了0.9[Pb(Mg/sub 1/3/Nb/sub 2/3/)O/sub 3/]-0.1PbTiO/sub 3/ (.9 pmn -.1PT)铁电薄膜的介电性能和晶体性能。采用脉冲激光烧蚀法在SrTiO/sub 3/ LaAlO/sub 3/、MgO和Pt/TiO/sub 2//SiO/sub 2//Si衬底上生长了0.9PMN-0.1PT和无过量PbO的陶瓷靶材薄膜。结果表明,膜的相纯度与膜的厚度有关。此外,我们已经表明,随着薄膜厚度从100nm增加到600nm,局部应变逐渐下降,因此薄膜的局部结晶度有所改善。薄膜的介电常数(10KHz时为3900)高于先前报道的0.9PMN-0.1PT薄膜。我们还表明,改变较低的电极有相当大的好处。XRD结果表明,薄膜在YBa/sub 2/Cu/sub 3/O/sub 7/(001)或SrRuO/sub 3/(001)上生长时呈高度的c轴取向,在Pt(111)上生长时呈(111)取向。晶粒的大小取决于成核密度和在下层电极上的生长速率。较慢的生长速度导致薄膜中铅在晶界处过量,而较快的生长速度导致更高的孔隙率。结果表明,在600/spl℃下退火1小时,气孔率降低,表面质量提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Crystalline properties of ferroelectric-relaxor PMN-PT thin films by pulsed laser deposition
The dielectric and crystalline properties of ferroelectric thin films of 0.9[Pb(Mg/sub 1/3/Nb/sub 2/3/)O/sub 3/]-0.1PbTiO/sub 3/ (.9PMN-.1PT) have been investigated. Ceramic targets of 0.9PMN-0.1PT with and without excess PbO were used for thin film deposition and were grown on substrates of SrTiO/sub 3/ LaAlO/sub 3/, MgO, and Pt/TiO/sub 2//SiO/sub 2//Si using pulsed laser ablation deposition. It was shown that the phase purity of the films was dependent on the film thickness. Furthermore we have shown that as the thickness of the films increases from 100nm to 600nm there is a progressive decline in the local strain and hence an improvement in the local crystallinity of the films. The dielectric constant for our films (3900 at 10KHz) is higher than previous reports on 0.9PMN-0.1PT films. We have also shown that there is considerable benefit in changing lower electrodes. The XRD shows that the films are highly c-axis orientated as grown on YBa/sub 2/Cu/sub 3/O/sub 7/ (001) or SrRuO/sub 3/ (001) and (111) orientated on Pt(111) lower electrodes. The sizes of the grains depend upon the nucleation density and the rate of growth onto the lower electrode used. Slower growth rates lead to excess of lead in the film at the grain boundaries while accelerated growth rates lead to higher porosity's. It was shown that annealing for 1 hour at 600/spl deg/C reduces porosity and improves surface quality.
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