用矢量扫描焦耳展开显微镜分析互连的动态失效

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232596

A.-K. Tiedemann, M. Fakhri, R. Heiderhoff, J. Phang, L. Balk

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引用次数: 4

摘要

垂直和横向扫描焦耳膨胀显微镜测量是第一次比较。通过引入热弹性输运机制的等效电路，分析了热-机械系统的频率特性。通过提高温度灵敏度和空间分辨率，可以对互连线的退化过程进行高级失效分析。

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Advanced dynamic failure analysis on interconnects by vectorized Scanning Joule Expansion microscopy

Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions.

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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