提高AlGaN/GaN高电子迁移率晶体管高频性能的新技术

J.W. Chung, E. Piner, J. C. Roberts, T. Palacios
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引用次数: 2

摘要

在本文中,我们采用物理分析、数值模拟和实验工作相结合的方法来克服AlGaN/GaN高电子迁移率晶体管(hemt)高频应用中的一些主要挑战。尽管gan基hemt具有优异的材料性能,但其高频性能仍低于理论预测。如果可以改善频率性能,氮化半导体优越的击穿特性将使这些器件成为Ka甚至W频段功率放大器的最佳选择。为了实现这一目标,我们首先确定了限制AlGaN/GaN hemt高频性能的一些关键参数,并展示了几种提高性能的技术。其中一些技术包括深亚微米t栅技术、薄体GaN hemt和先进的漏极延迟工程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New Technologies for Improving the High Frequency Performance of AlGaN/GaN High Electron Mobility Transistors
In this paper, we have used a combination of physical analysis, numerical simulation and experimental work to overcome some of the main challenges in AlGaN/GaN high electron mobility transistors (HEMTs) for high frequency applications. In spite of their excellent material properties, GaN-based HEMTs are still below the theoretical predictions in their high frequency performance. If the frequency performance could be improved, the superior breakdown characteristics of nitride semiconductors would make these devices the best option for power amplifiers at Ka and even W band frequencies. To achieve this goal, we have first identified some of the critical parameters that limit the high frequency performance of AlGaN/GaN HEMTs and we have demonstrated several technologies to increase the performance. Some of these technologies include deep-submicron T-gate technology, thin-body GaN HEMTs, and advanced drain delay engineering.
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