复合光聚合物微结构:从平面到3D器件

TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI:10.1109/SENSOR.2003.1216934

P. Renaud, S. Metz, S. Jiguet, A. Bertsch

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引用次数: 12

摘要

本文综述了利用光可定义聚合物作为结构材料，通过改变聚合物的物理性质来改变其孔隙度、力学或电学性能的一些技术。本文分为三个部分:(a)二维，多层光聚合物，(b)高纵横比和(c)三维微立体光刻技术。此外，作者还提到了光聚合在局部制造特殊结构方面的一些进展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Composite photopolymer microstructures: from planar to 3D devices

In this paper, a survey is made of some technologies in which the photo-definable polymer is used as structural material and where physical properties of polymers are modified to change porosity, mechanical or electrical properties. The paper is organized in three sections: (a) 2D, multilayer photopolymers, (b) High aspect ratio and (c) 3D micro-stereolithography technologies. In addition the authors mention some development in which photo-polymerization is used to locally create special structures.

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来源期刊

TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)

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