作为VLSI CAD工具的交互式良率估计器

I. Wagner, I. Koren
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引用次数: 4

摘要

超大规模集成电路芯片的成品率,除其他因素外,还取决于芯片对制造过程中出现的缺陷的敏感性。为了预测这种灵敏度,通常需要计算所谓的临界面积(A/sub / c/),它反映了导致电路故障的缺陷必须有多少和多大。产量估计的主要计算问题是如何有效地计算复杂、不规则布局下的A/sub / c/。针对这一问题,提出了一种新的求解方法,并给出了一种有效的求解算法。将该算法与使用蒙特卡罗方法(VLASIC)或确定性方法(SCA)的其他产量预测方法进行了比较,结果表明该算法更快。它还有一个优点,它可以图形化地显示详细的缺陷灵敏度图,这可以帮助物理设计师提高他/她的布局的产量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An interactive yield estimator as a VLSI CAD tool
The yield of a VLSI chip depends, among other factors, on the sensitivity of the chip to defects occurring during the fabrication process. To predict this sensitivity, one usually needs to compute the so-called critical area (A/sub c/) which reflects how many and how large the defects must be in order to result in a circuit failure. The main computational problem in yield estimation is to calculate A/sub c/ efficiently for complicated, irregular layouts. A novel approach is suggested for this problem that results in an algorithm to solve it efficiently. This algorithm is compared to other yield-prediction methods, which use either the Monte-Carlo approach (VLASIC) or a deterministic approach (SCA), and is shown to be faster. It also has the advantage that it can graphically show a detailed defect sensitivity map that can assist a physical designer in improving the yield of his/her layout.
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