利用s参数集成电路模型将汽车模块射频抗扰度测试极限转换为等效集成电路测试极限

H. Pues, Ben Brike, C. Gazda, P. Teichmann, K. Stijnen, Christian Peeters, A. Durier, D. Ginste
{"title":"利用s参数集成电路模型将汽车模块射频抗扰度测试极限转换为等效集成电路测试极限","authors":"H. Pues, Ben Brike, C. Gazda, P. Teichmann, K. Stijnen, Christian Peeters, A. Durier, D. Ginste","doi":"10.1109/EMCCOMPO.2013.6735209","DOIUrl":null,"url":null,"abstract":"A method to translate immunity specifications of automotive modules into equivalent requirements at integrated circuit (IC) level, using linear scattering parameter models of the ICs, is presented. A technique is described to determine S-parameters of ICs by simulations based on back-annotated analog schematics. The simulation results are compared with measurement data obtained using a specially designed test board. As an example, simulation and measurement results are given for the input stage of an automotive sensor interface. A good agreement is obtained from the lowest test frequency up to 1 GHz. Above this value, the measured results seem to be dominated by package effects.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"154 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Translation of automotive module RF immunity test limits into equivalent IC test limits using S-parameter IC models\",\"authors\":\"H. Pues, Ben Brike, C. Gazda, P. Teichmann, K. Stijnen, Christian Peeters, A. Durier, D. Ginste\",\"doi\":\"10.1109/EMCCOMPO.2013.6735209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method to translate immunity specifications of automotive modules into equivalent requirements at integrated circuit (IC) level, using linear scattering parameter models of the ICs, is presented. A technique is described to determine S-parameters of ICs by simulations based on back-annotated analog schematics. The simulation results are compared with measurement data obtained using a specially designed test board. As an example, simulation and measurement results are given for the input stage of an automotive sensor interface. A good agreement is obtained from the lowest test frequency up to 1 GHz. Above this value, the measured results seem to be dominated by package effects.\",\"PeriodicalId\":302757,\"journal\":{\"name\":\"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"volume\":\"154 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCCOMPO.2013.6735209\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCCOMPO.2013.6735209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

提出了一种利用集成电路的线性散射参数模型,将汽车模块的抗扰度指标转化为集成电路级等效要求的方法。描述了一种基于反向注释模拟原理图的模拟确定集成电路s参数的技术。仿真结果与在专门设计的测试板上获得的测量数据进行了比较。以某汽车传感器接口的输入级为例,给出了仿真和测量结果。在1ghz以下的最低测试频率下,得到了很好的一致性。在此值以上,测量结果似乎主要受一揽子效应的支配。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Translation of automotive module RF immunity test limits into equivalent IC test limits using S-parameter IC models
A method to translate immunity specifications of automotive modules into equivalent requirements at integrated circuit (IC) level, using linear scattering parameter models of the ICs, is presented. A technique is described to determine S-parameters of ICs by simulations based on back-annotated analog schematics. The simulation results are compared with measurement data obtained using a specially designed test board. As an example, simulation and measurement results are given for the input stage of an automotive sensor interface. A good agreement is obtained from the lowest test frequency up to 1 GHz. Above this value, the measured results seem to be dominated by package effects.
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