T. Youssef, E. Woirgard, S. Azzopardi, D. Martineau, R. Meuret
{"title":"薄膜的多物理场建模:有限元模拟工具的优化","authors":"T. Youssef, E. Woirgard, S. Azzopardi, D. Martineau, R. Meuret","doi":"10.1109/EUROSIME.2015.7103138","DOIUrl":null,"url":null,"abstract":"This paper focuses on the thin Nickel layer thicknesses. Thermal and mechanical behaviors of these thin layers in a power module are investigated. An approach is shown in order to present an improved modeling by considering the effect of these thin layers and by reducing time computation.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Multi-physics modelling of thin films: Optimization for finite elements simulations tools\",\"authors\":\"T. Youssef, E. Woirgard, S. Azzopardi, D. Martineau, R. Meuret\",\"doi\":\"10.1109/EUROSIME.2015.7103138\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper focuses on the thin Nickel layer thicknesses. Thermal and mechanical behaviors of these thin layers in a power module are investigated. An approach is shown in order to present an improved modeling by considering the effect of these thin layers and by reducing time computation.\",\"PeriodicalId\":250897,\"journal\":{\"name\":\"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-04-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2015.7103138\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2015.7103138","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Multi-physics modelling of thin films: Optimization for finite elements simulations tools
This paper focuses on the thin Nickel layer thicknesses. Thermal and mechanical behaviors of these thin layers in a power module are investigated. An approach is shown in order to present an improved modeling by considering the effect of these thin layers and by reducing time computation.