高性能片外总线的工作频率趋势

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819189

G. Katopis

{"title":"高性能片外总线的工作频率趋势","authors":"G. Katopis","doi":"10.1109/EPEP.1999.819189","DOIUrl":null,"url":null,"abstract":"This paper presents predictions for the operating frequency limits of the two main styles of inter-chip connections based on the existing product results for IBM's S/390 MCMs. Simulation results available in the literature are used to validate future projections for the operating frequency limit of synchronous interconnections (700 MHz) and source synchronous interconnections (1.5 GHz).","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"134 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Operating frequency trends for high performance off-chip buses\",\"authors\":\"G. Katopis\",\"doi\":\"10.1109/EPEP.1999.819189\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents predictions for the operating frequency limits of the two main styles of inter-chip connections based on the existing product results for IBM's S/390 MCMs. Simulation results available in the literature are used to validate future projections for the operating frequency limit of synchronous interconnections (700 MHz) and source synchronous interconnections (1.5 GHz).\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"134 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819189\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819189","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

本文基于IBM S/390 mcm的现有产品结果，对两种主要芯片间连接方式的工作频率限制进行了预测。文献中可用的仿真结果用于验证同步互连(700 MHz)和源同步互连(1.5 GHz)的工作频率限制的未来预测。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Operating frequency trends for high performance off-chip buses

This paper presents predictions for the operating frequency limits of the two main styles of inter-chip connections based on the existing product results for IBM's S/390 MCMs. Simulation results available in the literature are used to validate future projections for the operating frequency limit of synchronous interconnections (700 MHz) and source synchronous interconnections (1.5 GHz).

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

自引率

0.00%

发文量